Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
€329.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
€172.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide 1,50 mm, 1,27 mm and 1,00 pitch ball column terminal
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide stacked Fine-pitch ball grid array and fine-pitch land (P-PFBGA P-PFLGA)
€281.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
€390.00
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type (IEC 60191-6-12:2002); German version EN 60191-6-12:2002.
€105.42
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004.
€122.34
Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
€84.58
Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
€91.03
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitch land grid array (FLGA). Rectangular type
GRAFCET specification language for sequential function charts
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for fine-pitch ball grid array and land (FBGA/FLGA)
€201.00
Analysis techniques for dependability. Reliability block diagram method
