Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€82.00
Environnental Engineering (EE) - Environmental conditions and environmental tests for telecommunication equipment - Part 1-0 : classification of environmental conditions - Introduction (V2.1.2) - Télécommunications
€32.00
Environmental testing - Part 2-47 : tests - Mounting of specimens for vibration, impact and similar dynamic tests
€123.00
Environmental testing - Part 2-30 : tests - Test Db : damp heat, cyclic (12 h + 12 h cycle)
Environmental testing - Part 2-80 : tests - Test Fi : vibration - Mixed mode testing
€134.67
Environmental Testing - Part 2-10 : tests - Test J and Guidance : mould growth
Environmental testing - Part 2-21 : tests - Test U : robustness of terminations and integral mounting devices
€108.50
Environmental testing - Part 2-1 : tests - Tests A : cold
€93.33
Environmental testing - Part 2-2 : tests - Tests B : dry heat
Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
€106.33
Environmental testing - Part 2-82 : tests - Test XW1 : whisker test methods for electronic and electric components
€120.00
Environmental Testing - Part 2-6 : tests - Test Fc : vibration (sinusoidal)
Environmental testing - Part 2-27 : tests - Test Ea and guidance : shock
Environmental testing - Part 2-64 : tests - Test Fh : vibration, broadband random and guidance
€67.33
Environmental testing - Part 2-20 : tests - Test T : test methods for solderability and resistance to soldering heat of devices with leads
