31.200 : Integrated circuits. Microelectronics

PD IEC/TS 62132-9:2014

PD IEC/TS 62132-9:2014

Active Most Recent

Integrated circuits. Measurement of electromagnetic immunity radiated immunity. Surface scan method

€281.00

View more
BS EN 62132-1:2016

BS EN 62132-1:2016

Active Most Recent

Integrated circuits. Measurement of electromagnetic immunity General conditions and definitions

€281.00

View more
PD IEC/TR 61967-1-1:2015

PD IEC/TR 61967-1-1:2015

Active Most Recent

Integrated circuits. Measurement of electromagnetic emissions General conditions and definitions. Near-field scan data exchange format

€390.00

View more
BS EN 62228-2:2017

BS EN 62228-2:2017

Active Most Recent

Integrated circuits. EMC evaluation of transceivers LIN

€370.00

View more
BS EN 62433-4:2016

BS EN 62433-4:2016

Active Most Recent

EMC IC modelling Models of integrated circuits for RF immunity behavioural simulation. Conducted (ICIM-CI)

€421.00

View more
14/30310478 DC:2014

14/30310478 DC:2014

Active Most Recent

BS EN 62433-3. EMC IC modelling. Part 3. Models of Integrated Circuits for EMI behavioural simulation. Radiated emissions modelling (ICEM-RE)

€24.00

View more
BS EN 62433-3:2017

BS EN 62433-3:2017

Active Most Recent

EMC IC modelling Models of integrated Circuits for EMI behavioural simulation. Radiated emissions (ICEM-RE)

€421.00

View more
BS EN 60747-16-1:2002+A2:2017

BS EN 60747-16-1:2002+A2:2017

Active Most Recent

Semiconductor devices Microwave integrated circuits. Amplifiers

€421.00

View more
ASTM F744M-97

ASTM F744M-97

Superseded Historical

Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits

This product is not for sale, please contact us for more information

View more
ASTM F773-92

ASTM F773-92

Withdrawn Most Recent

Practice for Measuring Dose Rate Response of Linear Integrated Circuits

This product is not for sale, please contact us for more information

View more
ASTM F1260-89

ASTM F1260-89

Withdrawn Most Recent

Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations

This product is not for sale, please contact us for more information

View more
ASTM F1513-99

ASTM F1513-99

Superseded Historical

Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

This product is not for sale, please contact us for more information

View more
ASTM F1259M-96

ASTM F1259M-96

Superseded Historical

Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]

This product is not for sale, please contact us for more information

View more
ASTM F1260M-96

ASTM F1260M-96

Superseded Historical

Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]

This product is not for sale, please contact us for more information

View more
ASTM F59-68(1988)

ASTM F59-68(1988)

Withdrawn Most Recent

Method for Identification of Metal Particulate Contamination Found in Electronic and Microelectronic Components and Systems Using the Ring Oven Technique, With Spot Tests (Withdrawn 1994)

This product is not for sale, please contact us for more information

View more