31.240 : Mechanical structures for electronic equipment

DIN IEC 47D/131/CD:1996-11

DIN IEC 47D/131/CD:1996-11

Superseded Historical

Semiconductor devices, mechanical standardization - Proposal for a Glass sealed ceramic Qaud Flat Package (G-QFP) family (IEC 47D/131/CD:1996)

€63.27

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DIN IEC 47D/145/CDV:1997-01

DIN IEC 47D/145/CDV:1997-01

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)

€41.78

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DIN IEC 47D/147/CD:1997-02

DIN IEC 47D/147/CD:1997-02

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Proposed addition to the metric plastic quad flatpack family 1,0 - 133E, 0,80 - 134E und 0,65 - 135E (Intended for inclusion into IEC 60191-2) (IEC 47D/147/CD:1996)

€91.03

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DIN IEC 47D/148/CD:1997-02

DIN IEC 47D/148/CD:1997-02

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Proposed new plastic quad flatpack outline, 1,0 and 1,4 mm thick body families (Intended for inclusion into IEC 191-2) (IEC 47D/148/CD:1996)

€98.32

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DIN IEC 48D/119/CD:1997-06

DIN IEC 48D/119/CD:1997-06

Superseded Historical

Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 5: Subracks and associated plug-in for EMC, ESD, injector/extractor and keying (IEC 48D/119/CD:1997)

€91.03

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DIN IEC 47D/169/CDV:1997-09

DIN IEC 47D/169/CDV:1997-09

Withdrawn Most Recent

Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type I (IEC 47D/169/CDV:1997)

€48.79

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DIN IEC 47D/170/CDV:1997-09

DIN IEC 47D/170/CDV:1997-09

Withdrawn Most Recent

Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)

€48.79

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DIN IEC 47D/186/CDV:1997-10

DIN IEC 47D/186/CDV:1997-10

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Power package - HSOP (IEC 47D/186/CDV:1997)

€41.78

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DIN IEC 47D/196/CD:1998-01

DIN IEC 47D/196/CD:1998-01

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - 3-leaded SMD outline package (Body size D × E: 1,60 mm × 0,8 mm) (IEC 47D/196/CD:1997)

€41.78

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DIN IEC 47D/197/CD:1998-01

DIN IEC 47D/197/CD:1998-01

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Ceramic land grid array 1,0/0,8 mm pitch family (IEC 47D/197/CD:1997)

€48.79

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DIN IEC 47D/199/CD:1998-01

DIN IEC 47D/199/CD:1998-01

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - SON (Small Outline Non-Leaded Packages), 0,50 mm pitch family (IEC 47D/199/CD:1997)

€41.78

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DIN IEC 47D/195/CD:1998-02

DIN IEC 47D/195/CD:1998-02

Superseded Historical

Fin-pitch Ball-Grid-Array- and Land-Grid-Array 0,80 mm, 0,65 mm, 0,50 mm or 0,40 mm pitch family (IEC 47D/195/CD:1997)

€63.27

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DIN IEC 47D/198/CD:1998-02

DIN IEC 47D/198/CD:1998-02

Withdrawn Most Recent

SVP-(Surface Vertical package), 0,65 mm pitch family (IEC 47D/198/CD:1997)

€111.40

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DIN IEC 48D/139/CDV:1998-03

DIN IEC 48D/139/CDV:1998-03

Superseded Historical

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units; additional dimensions (IEC 48D/139/CDV:1997)

€41.78

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DIN IEC 48D/143/CD:1998-04

DIN IEC 48D/143/CD:1998-04

Superseded Historical

Detail specification for cabinets - Outdoor enclosures (IEC 48D/143/CD:1997)

€34.30

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