Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
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Standard Specification for Integrated Circuit Lead Frame Material
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
Practice for Determining Hydrolytic Stability of Plastic Encapsulants for Electronic Devices (Withdrawn 1994)
Emballage des composants pour opérations automatisées - Partie 3-1 : emballage des composants appropriés au montage en surface en bandes continues - Type V : bandes porteuses pressées
€93.33
Emballage de composants pour opérations automatisées - Partie 3-2 : emballage des composants appropriés au montage en surface en bandes continues - Type VI - Bandes porteuses à cloques de 4 mm de large
€76.00
Structures mécaniques pour équipement électronique - Essais pour les séries IEC 60917 et IEC 60297 - Partie 1 : exigences environnementales, montage d.essai et aspects de la sécurité des baies, bâtis, bacs à cartes et châssis dans des conditions d.intérieur
€106.33
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 60679-3:2001); German version EN 60679-3:2001.
€111.40
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
€56.17
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
€63.27
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
€77.20
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
€145.14
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard (IEC 60917-1:1998 + A1:2000); German version EN 60917-1:1998 + A1:2000.
€105.42
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2000); German version EN 61837-3:2000.
€98.32
