IEC 61014:2003 Programmes for reliability growth
€342.00
IEC 60684-3-406:2003 Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheets 406 to 408: Glass textile sleeving with PVC coating
€46.00
IEC 60966-2-2:2003 Radio frequency and coaxial cable assemblies - Part 2-2: Blank detail specification for flexible coaxial cable assemblies
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
€93.00
IEC 60966-4-1:2003 Radio frequency and coaxial cable assemblies - Part 4-1: Blank detail specification for semi-rigid coaxial cable assemblies
IEC 60966-4:2003 Radio frequency and coaxial cable assemblies - Part 4: Sectional specification for semi-rigid coaxial cable assemblies
€133.00
IEC TR 62188:2003 Secondary cells and batteries containing alkaline or other non-acid electrolytes - Design and manufacturing recommendations for portable batteries made from sealed secondary cells
IEC 60966-3-2:2003 Radio frequency and coaxial cable assemblies - Part 3-2: Detail specification for semi-flexible coaxial cable assemblies for GSM use (0,8 GHz - 1 GHz)
IEC 60512-10-4:2003 Connectors for electronic equipment - Tests and measurements - Part 10-4: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests - Test 10d: Electrical overload (connectors)
€23.00
IEC 60749-1:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General
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IEC 60749-2:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-8:2002/COR2:2003 Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€0.00
IEC 60749-10:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-11:2002/COR2:2003 Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC 60749-22:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
