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BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
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Summary
Soldering;Environmental testing;Solderability testing;Slots;Destructive testing;Semiconductor devices;Encapsulated;Holes;Integrated circuits;Climate;Thermal testing;Electronic equipment and components;Mechanical testing
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/01/2020 |
| Page Count | 16 |
| Themes | Mechanical testing |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
