21/30446636 DC:2021
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21/30446636 DC:2021

BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
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Summary

Printing board;Structures;Testing methods;Open systems interconnection

Technical characteristics

Publisher British Standards Institution (BSI)
Publication Date 10/29/2021
Page Count 18
Themes Open systems interconnection
EAN ---
ISBN ---
Weight (in grams) ---

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