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23/30436874 DC:2023
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/23/2023 |
| Page Count | 14 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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