BS EN 61190-1-2:2014
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BS EN 61190-1-2:2014

Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics

Summary

Electronic equipment and components;Pastes;Quality assurance;Electronic engineering;Classification systems;Soldered connectors;Solders;Soldering;Quality control;Electrical connections;Bonding

Technical characteristics

Publisher British Standards Institution (BSI)
Publication Date 06/30/2014
Page Count 26
Themes Bonding
EAN ---
ISBN ---
Weight (in grams) ---
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