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BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending
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Summary
Bend testing;Mechanical testing;Surface mounting;Surface mounting devices;Soldered joints;Cyclic;Integrated circuits;Endurance testing;Environmental testing;Soldering;Printed-circuit boards
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 03/31/2009 |
| Page Count | 18 |
| Themes | Printed-circuit boards |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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