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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
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Summary
Printed-circuit boards;Mechanical testing;Life (durability);Integrated circuits;Solders;Endurance testing;Soldering;Environmental testing;Electronic equipment and components;Surface mounting devices;Thermal testing;Soldered joints
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 06/30/2015 |
| Page Count | 48 |
| Themes | Soldered joints |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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