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BS EN IEC 60749-20:2020

Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect moisture soldering heat

Summary

Plastics;Climate;Thermal testing;Encapsulated;Surface mounting devices;Damp-heat tests;Environmental testing;Electronic equipment and components;Semiconductor devices;Integrated circuits;Soldering;Solderability testing;Mechanical testing

Technical characteristics

Publisher British Standards Institution (BSI)
Publication Date 10/14/2020
Page Count 32
Themes Mechanical testing
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