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BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)

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Publisher	British Standards Institution (BSI)
Publication Date	02/04/2025
Page Count	36
Themes	Components
EAN	---
ISBN	---
Weight (in grams)	---

Replaces

BS EN 61188-5-8:2008

Printed boards and printed board assemblies. Design use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

30/05/2008

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Most Recent

BS EN 61188-5-5:2007

Printed boards and printed board assemblies. Design use Attachment (land/joint) considerations. Components with gull- wing leads on four sides

31/12/2007

Active

Most Recent

BS EN 61188-5-4:2007

Printed boards and printed board assemblies. Design use Attachments (land/joint) considerations. Components with J leads on two sides

31/12/2007

Active

Most Recent

BS EN 61188-5-3:2007

Printed boards and printed board assemblies. Design use Attachment (land/joint) considerations. Components with gull- wing leads on two sides

31/12/2007

Active

Most Recent

BS EN 61188-5-2:2003

Printed boards and assemblies. Design use. Attachment (land/joint) considerations Discrete components

16/10/2003

Active

Most Recent

BS EN 61188-5-6:2003

Printed boards and assemblies. Design use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides

26/06/2003

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Most Recent

Previous versions

BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)

04/02/2025

Active

Most Recent

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