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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures assemblies Z-axis expansion of base materials
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Summary
Electronic equipment and components;Laminates;Structures;Printing board;Test methods
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 09/13/2023 |
| Page Count | 14 |
| Themes | Test methods |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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