Active
Standard
Most Recent
BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Decomposition temperature (Td) using TGA
Preview
Summary
Structures;Open systems interconnection;Printing board;Testing methods
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 11/05/2021 |
| Page Count | 14 |
| Themes | Testing methods |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.