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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Reflow soldering ability solder joint, reflow heat resistance
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Summary
Printing board;Heat resistance;Resistance (electrical);Testing;Electrical equipment
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 03/19/2021 |
| Page Count | 46 |
| Themes | Electrical equipment |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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