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BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
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Summary
Electrical connections;Solders;Pastes;Test methods;Quality assurance;Bonding;Particulate materials;Fluxes (materials);Soldering;Classification systems;Bars (materials);Quality control;Electronic engineering;Electronic equipment and components
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 03/28/2018 |
| Page Count | 50 |
| Themes | Electronic equipment and components |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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