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BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components through-hole reflow (THR) soldering
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Summary
Marking;Packaging;Surface mounting devices;Soldering;Electronic equipment and components;Cleaning;Integrated circuit technology;Solderability testing;Microassembling;Electrical components;Holes;Integrated circuits
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 03/18/2021 |
| Page Count | 34 |
| Themes | Integrated circuits |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
