Active
Standard
Most Recent
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Preview
Summary
Substrates (insulating);Structures;Electric connectors;Components;Electronic equipment and components
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 11/18/2019 |
| Page Count | 58 |
| Themes | Electronic equipment and components |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
31/08/2015
Superseded
Historical