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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
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Summary
Components;Modules;Evaluation;Electronic equipment and components;Assembly
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 08/20/2021 |
| Page Count | 18 |
| Themes | Assembly |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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