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BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling method applied to discrete type power electronic devices
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Summary
Testing;Test methods;Joining processes;Electronic equipment and components;Semiconductors
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 12/05/2023 |
| Page Count | 28 |
| Themes | Semiconductors |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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