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BS IEC 63011-2:2018
Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
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Summary
Test equipment;Impulse-voltage tests;Electrical measurement;Impulse voltages;Electronic equipment and components;Semiconductors;Integrated circuits;Electromagnetic compatibility;Transient voltages
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/24/2019 |
| Page Count | 18 |
| Themes | Transient voltages |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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