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BS IEC 63011-3:2018
Integrated circuits. Three dimensional integrated circuits Model and measurement conditions of through-silicon via
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Summary
Electromagnetic compatibility;Test equipment;Electrical measurement;Impulse voltages;Impulse-voltage tests;Electronic equipment and components;Semiconductors;Integrated circuits;Transient voltages
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/24/2019 |
| Page Count | 18 |
| Themes | Transient voltages |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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