BS IEC 63055:2023
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BS IEC 63055:2023

Format for LSI-Package-Board Interoperable design

Summary

Electromagnetic compatibility;Electronic equipment and components;Emission;Electric terminals;Printed-circuit boards;Electromagnetic fields;Integrated circuits;Noise (spurious signals);Electrical conductance;Simulation;Mathematical models

Technical characteristics

Publisher British Standards Institution (BSI)
Publication Date 11/08/2023
Page Count 298
Themes Mathematical models
EAN ---
ISBN ---
Weight (in grams) ---

Replaces

Previous versions

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