Superseded
Standard
Historical
DD IEC/PAS 62137-3:2008
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
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No description.
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/31/2009 |
| Cancellation Date | 03/31/2012 |
| Page Count | 46 |
| Themes | Mechanical testing |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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