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DIN 50441-1:1996-07 (R2021)
Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
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Summary
The method covers determination of the thickness of circular or D-shaped semiconductor wafers with any surface quality by using both contactless and contacting instruments for thickness measurement.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/1996 |
| Confirmation Date | 01/11/2021 |
| Cancellation Date | 07/01/2007 |
| Page Count | 0 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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