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DIN 8589-15:2003-09

Manufacturing processes chip removal - Part 15: Lapping; Classification, subdivision, terms and definitions

Summary

Lapping, which is a subgroup of chip removal, is integrated into the system of manufacturing production processes and subdivided into individual processes. The individual processes belonging to lapping are defined.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 09/01/2003
Page Count 7
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Weight (in grams) ---
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