DIN EN 1758:1998-03

The document specifies the composition, property requirements, tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with width up to and including 100 mm, with thickness from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for intergrated circuits and low power devices, or from 1,0 mm up to and including 2,0 mm, generally used for stamped lead frames for high power devices. The sampling procedures, the methods of test to be used for verification of compliance with the requirements of this standard, and the delivery conditions are also specified.