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DIN EN 60191-6-18:2010-08
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
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Summary
This document provides standard outline drawings, dimensions and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is one millimetre or larger.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2010 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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