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DIN EN 60191-6:2010-06
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009.
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Summary
This part of DIN EN 60191 gives general rules for the preparation of outlines drawings of surfacemounted semiconductor devices. It supplements DIN EN 60191-1 and DIN EN 60191-3. It covers all surface-mounted devices-discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits-classified as form E in clause3 of DIN EN 60191-4.
Notes
DIN EN 60191-6 (2005-04) remains valid alongside this standard until 2012-12-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2010 |
| Page Count | 40 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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