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DIN EN 60191-6-6:2002-02
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
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Summary
The document specifies a fin-pitch Ball-Grid-Array- and Land-Grid-array 0,80 mm, 0,65 mmm, 0,50 mm or 0,40 mm pitch family.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 02/01/2002 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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