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DIN EN 60749-40:2012-02

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011

Summary

This test method is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 02/01/2012
Page Count 23
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