Active
Standard
Most Recent
DIN EN 61190-1-1:2003-01
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
Preview
Summary
The document specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
Notes
Pour le(s) document(s) annulé(s) et non remplacé(s) DIN 32513-1 (2005-01) l'éditeur recommande ce document.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2003 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.