Superseded
Standard
Historical
DIN EN 61190-1-2:2003-01
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002.
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Notes
A transition period, as set out in DIN EN 61190-1-2 (2007-11), exists until 2010-05-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2003 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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