DIN EN 61190-1-3:2007-11
Superseded Standard
Historical

DIN EN 61190-1-3:2007-11

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007.
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Notes

DIN EN 61190-1-3 (2003-01) remains valid alongside this standard until 2010-05-01.*A transition period, as set out in DIN EN 61190-1-3 (2011-04), exists until 2013-09-01.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 11/01/2007
Page Count 8
EAN ---
ISBN ---
Weight (in grams) ---
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