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DIN EN 62258-6:2007-02
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006.
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Summary
This part of DIN EN 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
Notes
Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 02/01/2007 |
| Page Count | 12 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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