Superseded
Draft standard
Historical
DIN EN 62435-5:2013-10
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die & Wafer Devices (IEC 47/2174/CD:2013)
Preview
Summary
This part of DIN EN 62435 covering die and wafer devices, includes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder ball or bumps or other metallisation. This part also covers any special requirements for the primary packaging that to contain the die or wafers for handling purposes whether for automated use or not.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 10/01/2013 |
| Cancellation Date | 10/01/2017 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.