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DIN EN IEC 60749-15:2022-05
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020.
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Notes
DIN EN 60749-15 (2011-06) remains valid alongside this standard until 2023-08-18.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2022 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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