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DIN EN IEC 60749-20-1:2018-11
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
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Summary
This part of series DIN EN 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices that are exposed to the ambient air. It provides standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20.
Notes
Prévu pour remplacer DIN EN 60749-20-1 (2009-10).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/2018 |
| Page Count | 79 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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