DIN EN IEC 60749-20:2023-07
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DIN EN IEC 60749-20:2023-07

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020.
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Notes

DIN EN 60749-20 (2010-04) remains valid alongside this standard until 2023-10-05.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 07/01/2023
Page Count 8
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ISBN ---
Weight (in grams) ---
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