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DIN EN IEC 60749-37:2023-02
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020
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| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 02/01/2023 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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