DIN EN IEC 61188-6-2:2023-03
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DIN EN IEC 61188-6-2:2023-03

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
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Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 03/01/2023
Page Count 8
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ISBN ---
Weight (in grams) ---
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