DIN EN IEC 61189-2-807:2020-12
Superseded Draft standard
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DIN EN IEC 61189-2-807:2020-12

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA (IEC 91/1647/CD:2020); Text in German and English
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Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 12/01/2020
Page Count 8
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