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DIN EN IEC 62878-2-602:2022-08
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021
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| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2022 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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