Superseded
Draft standard
Historical
DIN IEC 60068-2-83:2007-09
Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
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Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 09/01/2007 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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