DIN IEC 60191-6-21:2009-02
Superseded Draft standard
Historical

DIN IEC 60191-6-21:2009-02

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
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Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 02/01/2009
Page Count 8
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ISBN ---
Weight (in grams) ---
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