DIN IEC 60191-6-9:2002-07
Withdrawn Draft standard
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DIN IEC 60191-6-9:2002-07

Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) (IEC 47D/490/CD:2002)
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Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 07/01/2002
Page Count 8
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ISBN ---
Weight (in grams) ---
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