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DIN IEC 61190-1-3:2005-09
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
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Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 09/01/2005 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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