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IEC 61188-1-2:1998
IEC 61188-1-2:1998 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
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Summary
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/29/1998 |
| Edition | 1.0 |
| Page Count | 83 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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